A new solder matrix nano polymer composite for thermal management applications
Artikel i vetenskaplig tidskrift, 2014
The increasing integration of microelectronics, raising the need for effective heat dissipation, requires new and improved composite materials technologies. For both thermal interface and die attach materials, a major challenge is to combine low thermal resistance joints with sufficient thermomechanical decoupiing and reliability. In this paper, we present the fabrication and characterisation of a new type of solder matrix nano polymer composite (SMNPC) aiming to address these challenges. The SMNPC is fabricated into preforms by liquid-phase infiltration of a Sn-Ag-Cu matrix into a silver nanoparticle coated electro spun polyimide fibre mesh. The composite is demonstrated to possess high heat transfer capability, close to that of a direct soldered interface, lower elastic modulus compared to pure Sn-Ag-Cu alloy, and reliable thermomechanical performance during thermal cycling. Taken together, the results indicate that the developed SMNPC can be a useful composite alternative compared to conventional solders and polymer matrix materials for thermal management applications. (C) 2014 Elsevier Ltd. All rights reserved.
V22
COPPER
NANOFIBERS
LEAD-FREE SOLDERS
Thermomechanical properties
Electrospinning
JOURNAL OF MATERIALS SCIENCE
MECHANICAL-PROPERTIES
Metal matrix composites (MMCs)
Liquid metal infiltration
CONDUCTIVE ADHESIVES
LANNAY F
CARBON NANOTUBES
POLYIMIDE
Nano composites
INTERMETALLIC COMPOUNDS
P1
INTERFACE MATERIALS
RELIABILITY
1987
Författare
Carl Zandén
Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system
Xin Luo
Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system
L. Ye
SHT Smart High Tech AB
Johan Liu
Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system
Composites Science and Technology
0266-3538 (ISSN)
Vol. 94 54-61Ämneskategorier (SSIF 2011)
Kompositmaterial och -teknik
DOI
10.1016/j.compscitech.2014.01.015