A new solder matrix nano polymer composite for thermal management applications
Journal article, 2014
The increasing integration of microelectronics, raising the need for effective heat dissipation, requires new and improved composite materials technologies. For both thermal interface and die attach materials, a major challenge is to combine low thermal resistance joints with sufficient thermomechanical decoupiing and reliability. In this paper, we present the fabrication and characterisation of a new type of solder matrix nano polymer composite (SMNPC) aiming to address these challenges. The SMNPC is fabricated into preforms by liquid-phase infiltration of a Sn-Ag-Cu matrix into a silver nanoparticle coated electro spun polyimide fibre mesh. The composite is demonstrated to possess high heat transfer capability, close to that of a direct soldered interface, lower elastic modulus compared to pure Sn-Ag-Cu alloy, and reliable thermomechanical performance during thermal cycling. Taken together, the results indicate that the developed SMNPC can be a useful composite alternative compared to conventional solders and polymer matrix materials for thermal management applications. (C) 2014 Elsevier Ltd. All rights reserved.
V22
COPPER
NANOFIBERS
LEAD-FREE SOLDERS
Thermomechanical properties
Electrospinning
JOURNAL OF MATERIALS SCIENCE
MECHANICAL-PROPERTIES
Metal matrix composites (MMCs)
Liquid metal infiltration
CONDUCTIVE ADHESIVES
LANNAY F
CARBON NANOTUBES
POLYIMIDE
Nano composites
INTERMETALLIC COMPOUNDS
P1
INTERFACE MATERIALS
RELIABILITY
1987
Author
Carl Zandén
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Xin Luo
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
L. Ye
SHT Smart High Tech AB
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Composites Science and Technology
0266-3538 (ISSN)
Vol. 94 54-61Subject Categories (SSIF 2011)
Composite Science and Engineering
DOI
10.1016/j.compscitech.2014.01.015