Graphene Heat Spreader for Thermal Management of Hot Spots
Paper i proceeding, 2013
Monolayer graphene was fabricated using thermal chemical vapor deposition (TCVD) as heat spreaders in electronic packaging. Platinum (Pt) thermal evaluation chips were utilized to evaluate the thermal performance of the graphene heat spreaders. Temperature of hot spot driven at a heat flux of up to 430W·cm -2 was decreased by about 13 °C with the attaching of the graphene heat spreader. We demonstrate the potentials of using CMOS compatible TCVD process to make graphene as heat spreader for power dissipation needs. © 2013 IEEE.
Författare
Zhaoli Gao
Chalmers, Mikroteknologi och nanovetenskap (MC2)
Yong Zhang
Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system
Yifeng Fu
Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system
Matthew Yuen
Hong Kong University of Science and Technology
Johan Liu
Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system
Proceedings of the IEEE 2013 Electronic Components & Technology Conference
0569-5503 (ISSN)
2075-2078978-147990233-0 (ISBN)
Styrkeområden
Nanovetenskap och nanoteknik
Ämneskategorier (SSIF 2011)
Nanoteknik
DOI
10.1109/ECTC.2013.6575865
ISBN
978-147990233-0