Graphene Heat Spreader for Thermal Management of Hot Spots
Paper in proceeding, 2013
Monolayer graphene was fabricated using thermal chemical vapor deposition (TCVD) as heat spreaders in electronic packaging. Platinum (Pt) thermal evaluation chips were utilized to evaluate the thermal performance of the graphene heat spreaders. Temperature of hot spot driven at a heat flux of up to 430W·cm -2 was decreased by about 13 °C with the attaching of the graphene heat spreader. We demonstrate the potentials of using CMOS compatible TCVD process to make graphene as heat spreader for power dissipation needs. © 2013 IEEE.
Author
Zhaoli Gao
Chalmers, Microtechnology and Nanoscience (MC2)
Yong Zhang
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Yifeng Fu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Matthew Yuen
Hong Kong University of Science and Technology
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Proceedings of the IEEE 2013 Electronic Components & Technology Conference
0569-5503 (ISSN)
2075-2078978-147990233-0 (ISBN)
Areas of Advance
Nanoscience and Nanotechnology
Subject Categories (SSIF 2011)
Nano Technology
DOI
10.1109/ECTC.2013.6575865
ISBN
978-147990233-0