Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of Sn-3.8Ag-0.7Cu solder joints
Paper in proceeding, 2005
Author
Cristina Andersson
Chalmers, Microtechnology and Nanoscience (MC2)
Dag R. Andersson
Per-Erik Tegehall
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Proceedings of the IMAPS 2005
523-528
Subject Categories (SSIF 2011)
Electrical Engineering, Electronic Engineering, Information Engineering