The Comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu) joints during isothermal aging and their tensile strengths
Journal article, 2008

Author

Guo-Kui Ju

Xi-cheng Wei

Peng Sun

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Other publications Research

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Other publications Research

Soldering & Surface Mount Technology

0945-0911 (ISSN)

Vol. 20 3 4-10

Subject Categories (SSIF 2011)

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017

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