Mechanical and thermal characterisaton of a novel nanocomposite thermal interface material for electronics packaging
Journal article, 2015
Author
Shuangxi Sun
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Si Chen
Chalmers, Applied Physics, Electronics Material and Systems
Xin Luo
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Yifeng Fu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Ye Lilei
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Microelectronics and Reliability
0026-2714 (ISSN)
Areas of Advance
Nanoscience and Nanotechnology
Subject Categories (SSIF 2011)
Materials Engineering