Reliability investigation of nano-enhanced thermal conductive adhesives
Paper in proceeding, 2012
This paper deals with silver (Ag) coated silicon carbide nanoparticles (SiC@Ag NPs) for thermal conductive interconnect and die attach applications.
Thermal conductive adhesive
Nanoparticles
Electroless plating
Silver coating
Thermal conductivity
Silicon carbide
Author
Nan Wang
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Murali Murugesan
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
L. Ye
SHT Smart High Tech AB
Björn Carlberg
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Si Chen
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Proceedings of the IEEE Conference on Nanotechnology
1944-9380 (eISSN)
978-146732198-3 (ISBN)
Subject Categories (SSIF 2011)
Physical Sciences
DOI
10.1109/NANO.2012.6322137
ISBN
978-146732198-3