MMIC-Based Components for MM-Wave Instrumentation
Magazine article, 2010

In this letter, we present results of fully integrated 90-130 GHz receiver based on 100 nm mHEMT technology. The receiver contains a low noise amplifier (LNA), mixer and LO multiplier chain integrated into a single monolithic microwave integrated circuit (MMIC). The circuit is packaged into a waveguide block, characterized and compared to on-wafer measurements. Waveguide to microstrip transitions are used to interface the MMIC to the waveguide. A breakout LNA circuit is also packaged, and its performance is compared to the receiver. The LNA noise was characterized on a wafer and after packaging. The packaged module is measured at both room and cryogenic temperatures, NF of 3.7 dB is measured at 300 K and 0.9 dB at 20 K.

Frequency multiplier

ghz

millimeter wave

millimeter wave circuits

monolithic microwave integrated circuit (MMIC)

receivers

118 GHz

mHEMT

Author

Vessen Vassilev

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

GigaHertz Centre

Niklas Wadefalk

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

GigaHertz Centre

Rumen Kozhuharov

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

GigaHertz Centre

Morteza Abbasi

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

GigaHertz Centre

Sten Gunnarsson

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

GigaHertz Centre

Herbert Zirath

Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics

GigaHertz Centre

T. Pellikka

Omnisys Instruments AB

A. Emrich

Omnisys Instruments AB

Miroslav Pantaleev

Chalmers, Earth and Space Sciences, Onsala Space Observatory

I. Kallfass

Fraunhofer-Institut fur Angewandte Festkorperphysik - IAF

A. Leuther

Fraunhofer-Institut fur Angewandte Festkorperphysik - IAF

IEEE Microwave and Wireless Components Letters

1531-1309 (ISSN)

Vol. 20 10 578-580

Subject Categories (SSIF 2011)

Electrical Engineering, Electronic Engineering, Information Engineering

DOI

10.1109/LMWC.2010.2065797

More information

Created

10/7/2017