Modeling of Nanostructured Polymer-Metal Composite for Thermal Interface Material Applications
Paper in proceeding, 2009
Author
Zhili Hu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Björn Carlberg
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Cong Yue
Xingming Guo
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
481-484
Subject Categories (SSIF 2011)
Materials Engineering