Thermal Conductivity of Electrically Conductive Adhesives Containing Fillers with Multi-modal Particle Size Distributions
Paper in proceeding, 2009

Author

Masahiro Inoue

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Other publications Research

ICEP

643-648

Subject Categories (SSIF 2011)

Materials Engineering

More information

Created

10/6/2017

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