Review of Current Progress of Thermal Interface Materials for Electronics Thermal Management Applications
Paper i proceeding, 2016
Increasing power densities within microelectronic systems place an ever increasing demand on the thermal management. Thermal interface materials (TIMs) are used to fill air gaps at the interface between two materials, greatly increasing the thermal conductance when solid surface are attached together. The last decade has provided significant development on high-performing TIMs, and this paper makes a summarized review on recent progress on the topic. Current state of the art commercial TIM types are presented, and discussed in regards to their advantages and disadvantages. Two main categories of TIMs with high interest are then reviewed: continuous metal phase TIMs and carbon nanotube array TIMs.
conduction
CROSTRUCTURE AND PROCESSING3rd International Conference on Materials for Advanced
Science & Technology - Other Topics
matrix composite
gallium
films
performance
solder
carbon nanotube arrays
Författare
Josef Hansson
Elektronikmaterial och system
Carl Zandén
Elektronikmaterial och system
L. Ye
SHT Smart High Tech AB
Johan Liu
Chalmers, Mikroteknologi och nanovetenskap (MC2), Fotonik
Elektronikmaterial och system
2016 Ieee 16th International Conference on Nanotechnology (Ieee-Nano)
371-374
978-1-5090-1493-4 (ISBN)
Styrkeområden
Nanovetenskap och nanoteknik
Ämneskategorier (SSIF 2011)
Elektroteknik och elektronik
Nanoteknik
DOI
10.1109/NANO.2016.7751383
ISBN
978-1-5090-1493-4