Study of interfacial reactions in Sn-3,5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate
Paper i proceeding, 2006
Författare
Si Chen
Chalmers, Mikroteknologi och nanovetenskap (MC2)
Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, Shanghai, China
Ämneskategorier (SSIF 2011)
Annan materialteknik