Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application
Paper i proceeding, 2014
The results of investigations of new compositions of electrically conductive adhesives (ECA) for printed electronics applications with and without nano-additives are presented. The studies covered the influence of nano additives on mechanical properties and reliability of interconnects made by elaborated, improved composition of the ECA based on primary conclusions. The obtained results showed that nano additives influence significantly and positively on mechanical properties of ECA joints, but their impact on the reliability properties of joints manufactured in low temperatures is much lower or even negative.
reliability of interconnects
Electrically conductive adhesives
mechanical properties
printed electronics
nano additives
Författare
J. Sitek
Instytut Tele-i Radiotechniczny, Warszawa
M. Koscielski
Instytut Tele-i Radiotechniczny, Warszawa
Y. Zhang
Shanghai University
J. Fan
Shanghai University
S. Ma
Shanghai University
Johan Liu
Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system
15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014
Art. no. 6922625 151-154
978-147994707-2 (ISBN)
Ämneskategorier (SSIF 2011)
Elektroteknik och elektronik
DOI
10.1109/ICEPT.2014.6922625
ISBN
978-147994707-2