Studies on Microstructure of Epoxy Molding Compound (EMC)-Leadframe Interface after Environmental Aging
Paper i proceeding, 2009
Författare
Xiuzhen Lu
Li Xu
Huaxiang Lai
Xinyu Du
Johan Liu
Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system
Zhaonian Cheng
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
1051-1053
Ämneskategorier (SSIF 2011)
Materialteknik