Adhesion Behavior between Epoxy Molding Compound and Different Leadframes in Plastic Packaging
Paper i proceeding, 2009
Författare
Li Xu
Xiuzhen Lu
Johan Liu
Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system
Du Xinyu
Yan Zhang
Zhaonian Cheng
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
1051-1053
Ämneskategorier (SSIF 2011)
Materialteknik