Electrical and Thermal Properties of Electrically Conductive Adhesives Using A Heat-resistant Epoxy Binder
Paper in proceeding, 2008

Author

Masahiro Inoue

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Proceedings of the 2nd Electronics Systemintegration Technology Conference

1147-1152

Subject Categories (SSIF 2011)

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017