Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging
Paper in proceeding, 2008
Author
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Yifeng Fu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Teng Wang
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging
E3-01
Subject Categories (SSIF 2011)
Electrical Engineering, Electronic Engineering, Information Engineering