Development of High Temperature Stable Isotropic Conductive Adhesives
Paper in proceeding, 2008
Author
Zhikun Zhang
Sijia Jiang
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Masahiro Inoue
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging
E3-04
Subject Categories (SSIF 2011)
Electrical Engineering, Electronic Engineering, Information Engineering