Nanostructured Polymer-metal Composite for Thermal Interface Material Applications
Paper in proceeding, 2008

Author

Björn Carlberg

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Teng Wang

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Yifeng Fu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Dongkai Shangguan

proceedings of the 57th IEEE Electronic Components and Technology Conference (ECTC)

191-197

Subject Categories (SSIF 2011)

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017