Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression
Journal article, 2008
Author
Xiangdong Zou
Yulai Gao
Qijie Zhai
Cristina Andersson
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Subject Categories (SSIF 2011)
Electrical Engineering, Electronic Engineering, Information Engineering