Reliability of Graphene-based Films Used for High Power Electronics Packaging
Paper in proceeding, 2015
Graphene-base film was fabricated with chemical conversion process, including graphene oxide (GO) prepared by Hummer's method, graphene oxide reduced with L-ascorbic acid (LAA), graphene based film deposited by vacuum filtration process. Meanwhile, the functionalization of the graphene-based film was performed to decrease the thermal interface resistance between the graphene-based film and substrate. Characterization data showed that the graphene-based film possessed high reliability after 500 hours under 85°C aging test. In summary, the graphene-based film can be a promising solution in thermal management of high power electronics.
reliability test
electronic packaging
graphene-based film
Author
Shirong Huang
Shanghai University
Yong Zhang
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Nan Wang
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
N. Wang
Shanghai University
Yifeng Fu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Lilei Ye
SHT Smart High Tech AB
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11-14 August 2015
852-855
978-1-4673-7999-1 (ISBN)
Areas of Advance
Nanoscience and Nanotechnology
Subject Categories (SSIF 2011)
Materials Engineering
DOI
10.1109/ICEPT.2015.7236714
ISBN
978-1-4673-7999-1