Microstructural evolution in electrically conductive adhesives containing Ag micro-fillers during curing and annealing
Paper in proceeding, 2012
Author
Masahiro Inoue
Hiroaki Muta
Shinsuke Yamanaka
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
CD Proceedings of the 4th Electronics System Integration Technologies Conference (ESTC 2012)
27-
Subject Categories (SSIF 2011)
Other Electrical Engineering, Electronic Engineering, Information Engineering