Low-temperature wafer-level transfer bonding
Journal article, 2001

Author

Niklaus Frank

Peter Enoksson

Department of Microelectronics

Patrick Griss

Edvard Kälvesten

Göran Stemme

Journal of Microelectromechanical Systems IEEE

Vol. 10 4 525 -531

Subject Categories (SSIF 2011)

Mechanical Engineering

Materials Engineering

Other Engineering and Technologies

Electrical Engineering, Electronic Engineering, Information Engineering

Areas of Advance

Nanoscience and Nanotechnology

Transport

Production

Materials Science

More information

Created

10/7/2017