Numerical study of thermal transfer between adhesive and CNTs
Paper in proceeding, 2011
Author
Yan Zhang
Shun Wang
Zhili Hu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Proceedings of the International Conference on Electronics Packaging (ICEP), Japan, Nara 2011 April 13-15
133 - 137
Areas of Advance
Nanoscience and Nanotechnology
Materials Science
Subject Categories (SSIF 2011)
Materials Engineering
Other Electrical Engineering, Electronic Engineering, Information Engineering