The effect of functionalized silver on properties of conductive adhesives
Paper in proceeding, 2011
This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.
Author
Q. Fan
Shanghai University
H. Cui
Shanghai University
D. Li
Shanghai University
Zhili Hu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Z. Yuan
Shanghai University
L. Ye
Chalmers University of Technology
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011
423-425
978-145771768-0 (ISBN)
Subject Categories (SSIF 2011)
Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/ICEPT.2011.6066868
ISBN
978-145771768-0