Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration

Journal article, 2011

Interconnection of carbon-nanotube (CNT)-filled through-silicon vias is demonstrated through an easy-to-implement process based on mechanical fastening. Direct CNT-to-CNT and CNT-to-Au contacts are realized at the microscale, and their specific contact resistances extracted from electrical measurements are approximately 1.2 × 10 -3 Ω cm 2 and 4.5 × 10 -4 Ω cm 2 , respectively. © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.