The effect of functionalized silver on rheological and electrical properties of conductive adhesives
Paper in proceeding, 2011
Author
Q. Fan
Shanghai University
H. Cui
Shanghai University
C. Fu
Shanghai University
D. Li
Shanghai University
X. Tang
Shanghai University
Z. Yuan
Shanghai University
L. Ye
SHT Smart High Tech AB
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
ECS Transactions
1938-5862 (ISSN) 1938-6737 (eISSN)
Vol. 34 1 811-816978-160768235-6 (ISBN)
Subject Categories (SSIF 2011)
Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1149/1.3567678
ISBN
978-160768235-6