Thermal Conductivity in the Vertical Direction of Heat-Resistant Epoxy Based Conductive Adhesives with Multimodal Filler Size Distributions
Other conference contribution, 2010
Author
Masahiro Inoue
H Muta
S Yamanaka
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
IEEE CPMT Electronics System Integration Conference (ESTC)
Subject Categories (SSIF 2011)
Other Materials Engineering
Areas of Advance
Materials Science