Ultrafast Transfer of Metal Enhanced Carbon Nanotubes at Low Temperature for Large Scale Electronics Assembly
Journal article, 2010
An indium-assisted ultrafast carbon nanotube (CNT) transfer method with a yield rate over 90% is described. Metal-coated as-transferred CNT structures exhibit excellent electrical performance that is at least one order of magnitude better than the previously published results. Shear test results show that the adhesion between CNTs and the substrate is greatly improved and excellent flexibility is obtained after the transfer process.
Author
Yifeng Fu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Yiheng Qin
Chalmers, Microtechnology and Nanoscience (MC2)
Teng Wang
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Si Chen
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Advanced Materials
09359648 (ISSN) 15214095 (eISSN)
Vol. 22 44 5039-5042Areas of Advance
Information and Communication Technology
Nanoscience and Nanotechnology
Materials Science
Subject Categories (SSIF 2011)
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1002/adma.201002415