Numerical investigation on the thermal properties of the micro-cooler
Paper in proceeding, 2010
Author
Yangming Liu
Shanghai University
Y. Zhang
Shanghai University
S. Wang
Shanghai University
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010
Article number 5583917 634-638
978-142448142-2 (ISBN)
Subject Categories (SSIF 2011)
Physical Sciences
DOI
10.1109/ICEPT.2010.5583917
ISBN
978-142448142-2