Reliability study for high temperature stable conductive adhesives
Other conference contribution, 2010
Contact resistance
Isotropic conductive adhesives
Humidity
Author
W. Tao
Shanghai University
Si Chen
Shanghai University
SMIT Ltd. Co.
Pär Berggren
SHT Smart High Tech AB
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10
74-77
978-142446756-3 (ISBN)
Subject Categories (SSIF 2011)
Physical Sciences
Other Materials Engineering
Areas of Advance
Materials Science
DOI
10.1109/ISAPM.2010.5441378
ISBN
978-142446756-3