Parallel plate cavity mode suppression in microstrip circuit packages using a lid of nails
Journal article, 2009
The suppression of parallel plate and cavity modes in shielded microstrip circuits is presented. To this aim a textured metal lid consisting of periodically located pins known as a bed of nails is employed. The mode suppression has a bandwidth of more than 2:1, and it does not interfere much with the microstrip circuit. Thereby, this mode suppression technique introduces a new advantageous packaging technology for high frequency circuits. © 2006 IEEE.
Gap waveguide
Microstrip circuit
Packaging
Mode suppression
Author
Eva Rajo
Chalmers, Signals and Systems, Kommunikationssystem, informationsteori och antenner
Ashraf Uz Zaman
Chalmers, Signals and Systems, Kommunikationssystem, informationsteori och antenner
Per-Simon Kildal
Chalmers, Signals and Systems, Kommunikationssystem, informationsteori och antenner
IEEE Microwave and Wireless Components Letters
1531-1309 (ISSN)
Vol. 20 1 31-33Subject Categories (SSIF 2011)
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/LMWC.2009.2035960