Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg
Paper in proceeding, 2009

Author

Yifeng Fu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Other publications Research

Teng Wang

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Other publications Research

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Other publications Research

Proceedings of the Annual Nordic Conference

35-38

Subject Categories (SSIF 2011)

Materials Engineering

More information

Created

10/7/2017

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