Study of the filler effect of the effective thermal conductivity of thermal conductive adhesive
Paper in proceeding, 2009

Author

Cong Yue

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Other publications Research

Zhaonian Cheng

Other publications Research

Jinyu Fan

ICEP

Subject Categories (SSIF 2011)

Mechanical Engineering

More information

Created

10/6/2017

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